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Proceedings Paper

Chip-scale integration of VCSEL, photodetector, and microlens arrays
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Paper Abstract

New generations of network application continue to demand component solutions of higher speed (10 Gbps and beyond) with good reliability and affordability. The potential of VCSEL arrays technology in meeting those demands has long been recognized and is being actively explored by many in the field. In this paper we present a few examples of VCSEL array based technology developments including monolithic integration of VCSELs and photodetector (PD) in both 1D and 2D arrays, and their hybrid integration with micro-lens array and electronic integrated circuits for optical interconnects. As we explore to achieve more functionality through integration, we also emphasize on the merits of usability of the electrical and optical interfaces of the new components, and producibility and manufacturability aspects of the new technologies.

Paper Details

Date Published: 3 June 2002
PDF: 8 pages
Proc. SPIE 4652, Optoelectronic Interconnects, Integrated Circuits, and Packaging, (3 June 2002); doi: 10.1117/12.469564
Show Author Affiliations
Yue Liu, Honeywell Inc. (United States)
Klein Johnson, Honeywell Inc. (United States)
Mary K. Hibbs-Brenner, Honeywell Inc. (United States)

Published in SPIE Proceedings Vol. 4652:
Optoelectronic Interconnects, Integrated Circuits, and Packaging
Louay A. Eldada; John R. Rowlette Sr.; Randy A. Heyler; Randy A. Heyler; John R. Rowlette Sr., Editor(s)

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