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Proceedings Paper

Effect of dopant ion on piezo-response in polyaniline-poly(vinylidine flouride) blends
Author(s): S. Radhakrishnan; Swarendu B. Kar
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Paper Abstract

Electromechanical sensors and actuators are important for robotic and aerospace applications. Among various material, poly(vinylidene fluoride) ir its co-polymers are known to exhibit high piezosensitivity. However, due to their higher electrical resistivity the input impedance of subsequent signal processign circuits is required to be very high. A novel technique to decrease the impedance would be blending PVDF with conducting polyaniline (PANI) but without affecting the piezosensitivyt of PVDF. Polyaniline (PANI) was synthesized by well known standard chemical route using dopants HCl and dodecyl benzene sulfonic acid. These PANI powder were blended with PVDF which was first dissolved in DMAc at 50 degrees C to which were added requisite amounts of two types of PANI ranging from 2 to 25 wt percent, stirred for 24 hours to form a homogeneous mixture which was cast in glass petri-dish, followed by complete solvent evaporation at 50 degrees C and then drying under vacuum for 24 hours to give films of PANI-PVDF blends. The piezo-sensitivity of these blends was measured before and after poling in electrical field. The sensitivity factor was dependent on the composition, type of dopant as well as the electric polarization of the blend. The HCl doped PANI blends in PVDF were highly piezo-sensitive than other blend compositions. These various results have been explained on the basis of compatibility, discrete domain formation, nonlinear conduction process for charge transport, orientation of dipoles, and trapping of space charge at inter-domain sites.

Paper Details

Date Published: 13 November 2002
PDF: 7 pages
Proc. SPIE 4934, Smart Materials II, (13 November 2002); doi: 10.1117/12.469171
Show Author Affiliations
S. Radhakrishnan, National Chemical Lab. (India)
Swarendu B. Kar, National Chemical Lab. (India)

Published in SPIE Proceedings Vol. 4934:
Smart Materials II
Alan R. Wilson, Editor(s)

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