
Proceedings Paper
Large deformation and mechanical behavior analysis using temporal speckle pattern interferometryFormat | Member Price | Non-Member Price |
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Paper Abstract
Ballistite and polymer materials are one kind of special composite material possessing the special properties of large deformations under loading. Because they have wide applications in aerospace industry and strong effects on the reliability and stability of the aerostats, experimental measuring the mechanical behaviors of these materials is highly emphasized. However, due to their special properties of the large and time-dependent deformations under loading, it is hard to use conventional optical methods to analyze their mechanical behavior. In this paper, two methods, scanning phase method (SPM) and time sequence phase method, have been used to large and time-dependent deformation analysis for ballistite and polymer materials. The deformation and creep behavior of the ballistite material is experimentally measured and analyzed under thermal loading and mechanical loading. Meanwhile, the large deformation of the polymer material is also measured under mechanical loading. The experiment results including the material parameters, the deformation and the creep curves are presented. The applicability and performance of these two methods are also discussed.
Paper Details
Date Published: 29 May 2002
PDF: 4 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468874
Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics
Xiaoping Wu; Yuwen Qin; Jing Fang; Jingtang Ke, Editor(s)
PDF: 4 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468874
Show Author Affiliations
Gang Tao, Tsinghua Univ. (China)
Xide Li, Tsinghua Univ. (China)
Xide Li, Tsinghua Univ. (China)
Huiji Shi, Tsinghua Univ. (China)
Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics
Xiaoping Wu; Yuwen Qin; Jing Fang; Jingtang Ke, Editor(s)
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