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Proceedings Paper

Application of noncontact deformation measurement in mechanical properties study of MEMS
Author(s): Xin Kang; Xiaoyuan He; Lin Liu
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Paper Abstract

The reliability and lifetime of microelectromechanical systems (MEMS) are strongly depending on the material properties. It is important to develop methods for the measurement of MEMS material properties. In this paper an optical technique for measuring tensile strain of micro-specimen is proposed. The technique, which is based on digital speckle correlation method works by determining the deformation of specimen between two neighboring loading step by step. The problem of non-correlation is solved when the deformation is too large. The experimental results of a copper wire are given in this paper. The proposed technique is also applicable for measuring other MEMS materials that may be even smaller or thinner than that used in this paper.

Paper Details

Date Published: 29 May 2002
PDF: 4 pages
Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); doi: 10.1117/12.468759
Show Author Affiliations
Xin Kang, Southeast Univ. (China)
Xiaoyuan He, Southeast Univ. (China)
Lin Liu, Southeast Univ. (China)

Published in SPIE Proceedings Vol. 4537:
Third International Conference on Experimental Mechanics
Xiaoping Wu; Yuwen Qin; Jing Fang; Jingtang Ke, Editor(s)

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