Share Email Print

Proceedings Paper

Laser micromachining of thin films for optoelectronic devices and packages
Author(s): David F. Moore; John A. Williams; Matthew A. Hopcroft; Billy Boyle; Johnny H. He; Richard R. A. Syms
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Focused laser micromachining in an optical microscope system is used to prototype packages for optoelectronic devices and to investigate new materials with potential applications in packaging. Micromachined thin fims are proposed as mechanical components to locate fibers and other optical and electrical components on opto-assemblies. This paper reports prototype structures which are micromachined in silicon carbide to produce beams 5 μm thick by (1) laser cutting a track in a SiC coated Si wafer, (2) undercutting by anisotropic silicon etching using KOH in water, and (3) trimming if necessary with the laser system. This approach has the advantage of fast turn around and proof of concept. Mechanical test data are obtained from the prototype SiC beam package structures by testing with a stylus profilometer. The Youngs modulus obtained for chemical vapor deposited silicon carbide is 360 +/- 50 GPa indicating that it is a promising material for packaging applications.

Paper Details

Date Published: 15 April 2003
PDF: 8 pages
Proc. SPIE 4941, Laser Micromachining for Optoelectronic Device Fabrication, (15 April 2003); doi: 10.1117/12.468490
Show Author Affiliations
David F. Moore, Cambridge Univ. (United Kingdom)
John A. Williams, Cambridge Univ. (United Kingdom)
Matthew A. Hopcroft, Cambridge Univ. (United Kingdom)
Billy Boyle, Cambridge Univ. (United Kingdom)
Johnny H. He, Cambridge Univ. (United Kingdom)
Richard R. A. Syms, Imperial College of Science, Technology and Medicine (United Kingdom)

Published in SPIE Proceedings Vol. 4941:
Laser Micromachining for Optoelectronic Device Fabrication
Andreas Ostendorf, Editor(s)

© SPIE. Terms of Use
Back to Top