Proceedings Paper
Reliable subnanometer repeatability for CD metrology in a reticle production environment| Format | Member Price | Non-Member Price |
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Paper Abstract
The new MueTec , an advanced CD metrology and review station operating at DUV (248nm) wavelength, has been extensively characterised in a reticle production environment. Performance data including resolution, measurement repeatability and throughput will be discussed. The system has demonstrated the ability to image 100nm Cr lines and sub-nanometer (3-sigma) long-term repeatability on lines and spaces down to 200nm in size. Metrology capability on contact hole and serif structures will also be discussed.
The paper will also introduce the application of a long working distance DUV objective compatible with pelliclised masks. With a 9% EAPSM reticle for 193nm wavelength a very appropriate image contrast was obtained with both objective types, allowing reliable automated linearity measurements on this type of reticle also.
In addition to the metrology performance of the tool, its integration into a manufacturing environment will also be described. This will show how the availability of networked co-ordinate data (either in the form of ASCII files or CATS data) and the high-accuracy stage of the tool enable efficient, automated measurement of large numbers of dense features under production conditions.
Paper Details
Date Published: 27 December 2002
PDF: 9 pages
Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); doi: 10.1117/12.468090
Published in SPIE Proceedings Vol. 4889:
22nd Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Kurt R. Kimmel, Editor(s)
PDF: 9 pages
Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); doi: 10.1117/12.468090
Show Author Affiliations
Andrew C. Hourd, Compugraphics International Ltd. (United Kingdom)
Anthony Grimshaw, Compugraphics International Ltd. (United Kingdom)
Gerd Scheuring, MueTec GmbH (Germany)
Christian Gittinger, MueTec GmbH (Germany)
Stefan Doebereiner, MueTec GmbH (Germany)
Frank Hillmann, MueTec GmbH (Germany)
Hans-Juergen Brueck, MueTec GmbH (Germany)
Shiuh-Bin Chen, Taiwan Mask Corp. (Taiwan)
Anthony Grimshaw, Compugraphics International Ltd. (United Kingdom)
Gerd Scheuring, MueTec GmbH (Germany)
Christian Gittinger, MueTec GmbH (Germany)
Stefan Doebereiner, MueTec GmbH (Germany)
Frank Hillmann, MueTec GmbH (Germany)
Hans-Juergen Brueck, MueTec GmbH (Germany)
Shiuh-Bin Chen, Taiwan Mask Corp. (Taiwan)
Parkson W Chen, Taiwan Mask Corp. (Taiwan)
Rik M. Jonckheere, IMEC vzw (Belgium)
Vicky Philipsen, IMEC vzw (Belgium)
Hans Hartmann, PDF Solutions GmbH (Germany)
Volodymyr Ordynskyy, PDF Solutions GmbH (Germany)
Kai Peter, PDF Solutions GmbH (Germany)
Thomas Schaetz, Infineon Technologies AG (United States)
Karl Sommer, Karl Sommer Consulting (Germany)
Rik M. Jonckheere, IMEC vzw (Belgium)
Vicky Philipsen, IMEC vzw (Belgium)
Hans Hartmann, PDF Solutions GmbH (Germany)
Volodymyr Ordynskyy, PDF Solutions GmbH (Germany)
Kai Peter, PDF Solutions GmbH (Germany)
Thomas Schaetz, Infineon Technologies AG (United States)
Karl Sommer, Karl Sommer Consulting (Germany)
Published in SPIE Proceedings Vol. 4889:
22nd Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Kurt R. Kimmel, Editor(s)
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