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Proceedings Paper

Automated defect severity analysis for binary and PSM mask defects
Author(s): Lynn Cai; Jiunn-Hung Chen; Lin-Hsin Tu; Brian Chu; Noah Chen; Te Yang Fang; W. B. Shieh
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Paper Abstract

Traditionally, mask defect analysis has been done through a visual inspection review. As the semiconductor industry moves into smaller process generations and the complexity of mask exponentially increases, the traditional mask defect analysis method becomes very time consuming. The Automatic Defect Severity Scoring (ADSS) module of i-Virtual Stepper System from Numerical Technologies offers an extremely fast and highly accurate software solution for defect printability analysis of advanced masks such as OPC and phase-shifting masks in a real production environment. In a previous paper [1], we have introduced the ADSS concept and discussed some results for line-space patterns on OPC and non-OPC masks. In this paper, we will discuss the ADSS results for both line-space and contact patterns on attenuated phase-shifting masks (ATTPSM), together with some ADSS results for line-space patterns on binary masks. The ADSS results are compared to wafer results. The wafer exposures were performed using 248 nm imaging technology and inspection images were generated on a KLA-Tencor’s SLF27 system.

Paper Details

Date Published: 27 December 2002
PDF: 10 pages
Proc. SPIE 4889, 22nd Annual BACUS Symposium on Photomask Technology, (27 December 2002); doi: 10.1117/12.467436
Show Author Affiliations
Lynn Cai, Numerical Technologies, Inc. (United States)
Jiunn-Hung Chen, Numerical Technologies, Inc. (United States)
Lin-Hsin Tu, United Microelectronic Corp. (Taiwan)
Brian Chu, United Microelectronic Corp. (Taiwan)
Noah Chen, United Microelectronic Corp. (Taiwan)
Te Yang Fang, United Microelectronic Corp. (Taiwan)
W. B. Shieh, United Microelectronic Corp. (Taiwan)

Published in SPIE Proceedings Vol. 4889:
22nd Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Kurt R. Kimmel, Editor(s)

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