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Proceedings Paper

Microstructure defect detection using thermal response
Author(s): Brandon Olson; Kuan H. Chen
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Paper Abstract

Detecting thermal and mechanical defects within multilayered microstructures is an important research area within the microdevice community. The detection of material flaws, mechanical damage, and packaging irregularities is often critical to the overall performanc eof the end product. The technique presented hereafter uses a series of surface temperature measurements, generated by a step function heat flux, to determine the thermal properties of a one- dimensional structure. These properties can either be used directly in a design effort, or they can be used as an indicator of problems that may exist within the structure. This technique is essentially non-invasive and it places no requirements on structure size, thus it is predisposed to semiconductor and MEMS applications. The technique exploits a thermal-electrical analog to match a measured thermal resistance pattern with the pattern of a corresponding thermal structure. Typically, the dimensions of the structure and the disturbance amplitude are required for property value determination.

Paper Details

Date Published: 19 April 2002
PDF: 12 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462876
Show Author Affiliations
Brandon Olson, Univ. of Utah (United States)
Kuan H. Chen, Univ. of Utah (United States)

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Bernard Courtois; Jean Michel Karam; Karen W. Markus; Bernd Michel; Tamal Mukherjee; James A. Walker, Editor(s)

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