This paper presents a high-speed resolution phase-only microelectromechanical system (MEMS) spatial light modulator (SLM), integrated with driver electronics, using through- wafer vias and solder bump bonding. It employs a polysilicon thin film MEMS technology that is well suited to micromirror array fabrication and offers significant improvement in SLM speed in comparison to alternative modulator technologies. Vertical through-wafer interconnections offer scalability required to achieve 1M-pixel array size. The design, development, fabrication and characterization of a scalable driver integrated SLM is discussed. Pixel opto- electromechanical performance has been quantified experimentally on prototypes, and results are reported.

Date Published: 19 April 2002
PDF: 8 pages
Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); doi: 10.1117/12.462846

Published in SPIE Proceedings Vol. 4755:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2002
Bernard Courtois; Jean Michel Karam; Karen W. Markus; Bernd Michel; Tamal Mukherjee; James A. Walker, Editor(s)