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Proceedings Paper

Glass requirements for encapsulating metallurgical diodes
Author(s): Mir Akbar Ali; Gerald L. Meldrum; Jeffry M. Krieger
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Paper Abstract

Environmental temperature variations cause stresses to develop in structures that contain materials with different coefficients of thermal expansion. Such a condition often exists in glass encapsulated diodes used in the electronic systems. The situation is further aggravated by the metallurgy of the diodes in the form of stresses due to corrosion--the stress corrosion effect. A third factor that introduces stresses in the encapsulated diodes is due to the design of the glass encapsulation. A combination of these factors led to a failure of glass encapsulated diodes and were identified in a recent study conducted at the Technology Support Division (TSD), Electro-Optical and Data Systems Group of Hughes Aircraft Company. A judicious selection of the encapsulating glasses, its properties, and the design of the seal becomes an important factor in the fabrication of a hermetically sealed diode. This paper highlights such failure mechanisms and describes the desirable properties and design requirements of sealing glasses used for encapsulating the diodes.

Paper Details

Date Published: 1 August 1991
PDF: 9 pages
Proc. SPIE 1513, Glasses for Optoelectronics II, (1 August 1991); doi: 10.1117/12.46026
Show Author Affiliations
Mir Akbar Ali, Hughes Aircraft Co. (United States)
Gerald L. Meldrum, Hughes Aircraft Co. (United States)
Jeffry M. Krieger, Hughes Aircraft Co. (United States)

Published in SPIE Proceedings Vol. 1513:
Glasses for Optoelectronics II
Giancarlo C. Righini, Editor(s)

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