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Proceedings Paper

Photoresist shape reconstruction from secondary scanning electron microscopy
Author(s): Parvez Ahammad; Amar Mukherjee
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Paper Abstract

The paper discusses the approach of using single detector system to classify the photo resist surface using different signal and image processing methodologies. We couple the understanding of the physical phenomenon and come up with an integrated method to generally classify the surface depending upon the side wall curvature. Construction of 3-D image of the surface and extracting features from the methods to classify the surfaces are the predominant aspects of the approach. We have used several methods to serve the purpose including the wavelet filters in edge and surface roughness detection. In this paper, non-stereoscopic 3-D shape reconstruction method is applied to address a difficult inverse problem in semiconductor fabrication metrology. The problem is that of deducing a chip's vertical cross-section from two-dimensional top-down scanning electron microscope images of the chip surface. Our results are illustrated with a variety of real data sets. In semiconductor chip fabrication, photo resistive material is used as an overlay, which will protect substrate areas (typically metal), which must remain on the chip after other unprotected substrate areas are etched off. The shape and size of the photo-resist material, at the submicron level, is therefore largely responsible for the shape and quality of the protected substrate. Critical dimension scanning electron microscopy (SEM) is used to determine this shape, and the research addressed in this paper proposes an image processing approach combined with physical modeling, to accurately obtain surface shape information from SEM imaging.

Paper Details

Date Published: 11 March 2002
PDF: 9 pages
Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); doi: 10.1117/12.458364
Show Author Affiliations
Parvez Ahammad, Univ. of Central Florida (United States)
Amar Mukherjee, Univ. of Central Florida (United States)

Published in SPIE Proceedings Vol. 4562:
21st Annual BACUS Symposium on Photomask Technology
Giang T. Dao; Brian J. Grenon, Editor(s)

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