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Proceedings Paper

Laser singulation of IC packages
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Paper Abstract

The separation of IC packages from a BGA board is realized by means of laser multi-scan method. The laser used in the study is a double frequency Nd-YAG laser with wavelength of 532 nm. The big problem in the laser processing approach mainly arises from the multi-layer materials of BGA board with copper, polyethylene and epoxy glass fiber, because of their different absorption coefficient to the laser beam and their different absorption coefficient to the laser beam and their different heat conductivity. In the experiment approach, the effects of laser parameters, such as wavelength, on the dicing efficiency has been investigated for choosing laser. The influence of sample side for laser incidence on cut profile and, the influence of the focused extent of laser beam on singulation speed are discussed. The experimental results show that laser singulation of IC packages is efficient and reliable.

Paper Details

Date Published: 25 February 2002
PDF: 3 pages
Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456850
Show Author Affiliations
Chengwu An, Data Storage Institute (Singapore)
Kaidong D. Ye, Data Storage Institute (Singapore)
Yuan Yuan, Data Storage Institute (Singapore)
Minghui Hong, Data Storage Institute (Singapore)
Yongfeng Lu, Data Storage Institute (United States)

Published in SPIE Proceedings Vol. 4426:
Second International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Yong Feng Lu; Koji Sugioka; Jan J. Dubowski, Editor(s)

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