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Proceedings Paper

Laser reflow plastic ball grid array
Author(s): DaMing Liu; Tao Chen; Yuan Yuan; Yongfeng Lu; Minghui Hong; Ryan J. K. Goh
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Paper Abstract

A modified fast-modulated CW Nd:YAG is used to reflow plastic ball grid array (PBGA). Sn-Pb eutectic solder balls with a diameter of 760 micrometers and Au-Ni-Cu solder pads are used in the study. Shear strength tests are preformed to find out the optimal reflow parameters. An energy equilibrium model is proposed to estimate the average temperatures of solder joint under the given experimental conditions. Based on the experimental and theoretical results, a parameter range for laser reflow of the 760 micrometers Sn-Pb eutectic solder balls is proposed.

Paper Details

Date Published: 25 February 2002
PDF: 4 pages
Proc. SPIE 4426, Second International Symposium on Laser Precision Microfabrication, (25 February 2002); doi: 10.1117/12.456834
Show Author Affiliations
DaMing Liu, Data Storage Institute (Singapore)
Tao Chen, Laser Research Pte Ltd. (Singapore)
Yuan Yuan, Data Storage Institute (Singapore)
Yongfeng Lu, Data Storage Institute (United States)
Minghui Hong, Data Storage Institute (Singapore)
Ryan J. K. Goh, Laser Research Pte Ltd. (United States)

Published in SPIE Proceedings Vol. 4426:
Second International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Yong Feng Lu; Koji Sugioka; Jan J. Dubowski, Editor(s)

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