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Proceedings Paper

Spectroscopic observations of space objects and phenomena using Spica and Kala at AMOS
Author(s): Daron L. Nishimoto; John L. Africano; Paul F. Sydney; Kris M. Hamada; Vicki Soo Hoo; Paul W. Kervin; Eugene G. Stansbery
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Paper Abstract

The Spica and Kala spectrographs located at the rear blanchard of the 1.6 m telescope and the trunnion port of the AEOS 3.67 m telescope, respectively, have been utilized by several DoD and NASA agencies requiring relatively high resolution spectroscopic observations. The sensors are located at the Air Force Maui Optical Station (AMOS), Haleakala, Maui. Three R&D programs utilizing these instruments will be described. The AFRL propulsion directorate's demonstration called the electric propulsion space experiment (ESEX) utilized Spica to evaluate high powered arc-jet thruster firings from the ARGOS satellite. AFRL Det. 15 and Air Force Battlelab sponsored a project called SILC to explore the advantages of applying spectroscopic analysis to help reduce satellite cross- tagging and augment Satellite Object Identification (SOI). Thirdly, the NASA Johnson Space Center Space Debris Program obtained spectroscopic data on Low Earth Orbit (LEO) targets to help determine albedo and material composition of space debris.

Paper Details

Date Published: 27 December 2001
PDF: 9 pages
Proc. SPIE 4490, Multifrequency Electronic/Photonic Devices and Systems for Dual-Use Applications, (27 December 2001); doi: 10.1117/12.455428
Show Author Affiliations
Daron L. Nishimoto, Oceanit Labs., Inc. (United States)
John L. Africano, The Boeing Co. (United States)
Paul F. Sydney, The Boeing Co. (United States)
Kris M. Hamada, The Boeing Co. (United States)
Vicki Soo Hoo, The Boeing Co. (United States)
Paul W. Kervin, Air Force Research Lab. (United States)
Eugene G. Stansbery, NASA Johnson Space Ctr. (United States)

Published in SPIE Proceedings Vol. 4490:
Multifrequency Electronic/Photonic Devices and Systems for Dual-Use Applications
Paul S. Idell; Andrew R. Pirich; Stanley R. Czyzak; Paul L. Repak; Paul S. Idell; Stanley R. Czyzak, Editor(s)

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