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Proceedings Paper

MEMS sensor packaging using LTCC substrate technology
Author(s): Harri K. Kopola; Jaakko Lenkkeri; Kari Kautio; Altti Torkkeli; Outi Rusanen; Tuomo Jaakola
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Paper Abstract

Low Temperature Cofired Ceramic (LTCC) material can be used as a reliable multilayer substrate material for silicon based MEMS component packaging due to many benefits like hermeticity, good match of thermal expansion coefficient (TCE) to silicon to minimise packaging-induced thermomechanical stresses, and the possibility to make cavities into the structure. The applicability of LTCC technologies for MEMS packaging is described in this paper. A review of the technologies used in making LTCC modules, such as substrate manufacturing, interconnecting, sealing and protection, and the benefits of LTCC for MEMS packaging is presented. Also examples on the use of LTCC technology for MEMS sensor packaging are discussed.

Paper Details

Date Published: 21 November 2001
PDF: 11 pages
Proc. SPIE 4592, Device and Process Technologies for MEMS and Microelectronics II, (21 November 2001); doi: 10.1117/12.448960
Show Author Affiliations
Harri K. Kopola, VTT Electronics (Finland)
Jaakko Lenkkeri, VTT Electronics (Finland)
Kari Kautio, VTT Electronics (Finland)
Altti Torkkeli, VTT Electronics (Finland)
Outi Rusanen, Nokia (Finland)
Tuomo Jaakola, VTT Electronics (Finland)

Published in SPIE Proceedings Vol. 4592:
Device and Process Technologies for MEMS and Microelectronics II
Jung-Chih Chiao; Lorenzo Faraone; H. Barry Harrison; Andrei M. Shkel, Editor(s)

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