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Proceedings Paper

Thin films residual stress measurement by optical profilometry
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Paper Abstract

The study of intrinsic stress in PVD thin films is rather important because it is related to the films' to substrate adherence, and influences the coated component during service. Stress is strongly induced during the film growth process that is controlled by the deposition parameters. The residual stress of the as-deposited PVD coatings causes bending of the coating/substrate system. If residual stresses are present, but the overall detection is small compared with the substrate thickness, then by symmetry the coated substrate will take up a spherical curvature in the region away from the edges. In this communication we will report on our work on residual stress evaluation of different kinds of thin films, by profilometric optical inspection of the film/substrate system. The inspection system we used, the MICROTOP.06.MFC, is an active optical triangulation sensor developed by the author at the Universidade do Minho. It allows depth resolutions down to 7 nm and lateral resolutions down to 1 )mum.

Paper Details

Date Published: 30 October 2001
PDF: 8 pages
Proc. SPIE 4596, Advanced Photonic Sensors and Applications II, (30 October 2001); doi: 10.1117/12.447335
Show Author Affiliations
Manuel Filipe M. Costa, Univ. do Minho (Portugal)

Published in SPIE Proceedings Vol. 4596:
Advanced Photonic Sensors and Applications II
Anand Krishna Asundi; Wolfgang Osten; Vijay K. Varadan, Editor(s)

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