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Proceedings Paper

Design, simulation, and evaluation of novel corrugated diaphragms based on backside sacrificial layer etching technique
Author(s): Jing Chen; Li-Tian Liu; Zhijian Li
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Paper Abstract

A novel single-chip condenser structure consists of a corrugated diaphragm and a backplate is presented using the backside sacrificial layer etching technique. Several kinds of corrugated diaphragms achieved by the anisotropic etch with KOH solution and Inductively Coupled Plasma (ICP) etch have been designed and simulated. An electrostatic-structural coupling FEM analysis was performed using the commercial FEA software ANSYS. The influence of various nonlinear effects on the performance of diaphragms are studied and all the corrugated diaphragms show a sensitivity more than one order larger than that of the flat diaphragm of equal size and thickness. The optimum balance between performance and stability is found.

Paper Details

Date Published: 15 October 2001
PDF: 5 pages
Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); doi: 10.1117/12.444736
Show Author Affiliations
Jing Chen, Tsinghua Univ. (China)
Li-Tian Liu, Tsinghua Univ. (China)
Zhijian Li, Tsinghua Univ. (China)

Published in SPIE Proceedings Vol. 4601:
Micromachining and Microfabrication Process Technology and Devices
Norman C. Tien; Qing-An Huang, Editor(s)

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