Patterned wafer defect inspection has evolved from manual to automated wafer inspection equipment. The success of certain applications (and resulting yield improvement) using automated wafer inspection equipment is well documented. Automated wafer inspection equipment currently in use in the semiconductor industry has primarily been utilized in engineering analysis applications. Advances in inspection technology now allow for automated wafer inspection to become a more integral part of the manufacturing strategy. As automated wafer inspection becomes more widespread in the manufacturing line, data analysis issues specific to automated wafer inspection arise. This paper describes general patterned wafer inspection applications and associated requirements in terms of ensuring the quality of data generated. Techniques to help the user more efficiently gather and use defect data are presented. Key equipment characteristics needed for each application are then reviewed.

Date Published: 1 July 1991
PDF: 6 pages
Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); doi: 10.1117/12.44470

Published in SPIE Proceedings Vol. 1464:
Integrated Circuit Metrology, Inspection, and Process Control V
William H. Arnold, Editor(s)