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Proceedings Paper

High-aspect-ratio PMMA microstructures fabricated by RIE
Author(s): Aibin Yu; Guifu Ding; Chunsheng Yang; Changmin Li; Haiping Mao; Zhiping Ni
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Paper Abstract

RIE is a promising way to fabricate high aspect ratio micro-structures and the PMMA is a widely used thick resist. In this paper, we developed a reactive ion etching of PMMA process in O2 plasma to fabricate micro-structures. High etch rate(0.5 micrometers /min) and smooth surface were achieved. In order to get high selectivity, We use Ni film as mask, which was patterned by photochemical etching. The etch results showed that vertical etch profile(base angle>88 degree(s)), high aspect ratio (5:1) and through-out etching of PMMA(100micrometers in thickness) could be obtained if select optimum etching conditions. We also found that the self-bias is one of the critical parameters during the process. If etching power was too high, the surface would be deformed due to the high energetic particles bombardment

Paper Details

Date Published: 15 October 2001
PDF: 6 pages
Proc. SPIE 4601, Micromachining and Microfabrication Process Technology and Devices, (15 October 2001); doi: 10.1117/12.444692
Show Author Affiliations
Aibin Yu, Shanghai Jiao Tong Univ. (China)
Guifu Ding, Shanghai Jiao Tong Univ. (China)
Chunsheng Yang, Shanghai Jiao Tong Univ. (China)
Changmin Li, Shanghai Jiao Tong Univ. (China)
Haiping Mao, Shanghai Jiao Tong Univ. (China)
Zhiping Ni, Shanghai Jiao Tong Univ. (China)

Published in SPIE Proceedings Vol. 4601:
Micromachining and Microfabrication Process Technology and Devices
Norman C. Tien; Qing-An Huang, Editor(s)

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