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Proceedings Paper

Measuring films on and below polycrystalline silicon using reflectometry
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Paper Abstract

Visible and ultraviolet light reflectometry provides a fast, convenient, and nondestructive method of characterizing multilayer film structures that include polycrystalline silicon. Reflectance measurements of silicon wafers containing such films have provided information as to the roughness of the poly surface, the thickness of the films, and the optical properties of the poly.

Paper Details

Date Published: 1 July 1991
PDF: 8 pages
Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); doi: 10.1117/12.44467
Show Author Affiliations
Herbert L. Engstrom, Tencor Instruments (United States)
Stanley E. Stokowski, Tencor Instruments (United States)

Published in SPIE Proceedings Vol. 1464:
Integrated Circuit Metrology, Inspection, and Process Control V
William H. Arnold, Editor(s)

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