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Proceedings Paper

Characterization of automatic overlay measurement technique for sub-half-micron devices
Author(s): Akira Kawai; Keiji Fujiwara; Kouichirou Tsujita; Hitoshi Nagata
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Paper Abstract

Measurement precision, especially the measurement offset of an automatic overlay measurement technique, was studied for application to sub-half micron device manufacturing. Experimental data showed that the measurement offset depended on the cross-section structure rather than the reflectivity or the roughness of the overlay marks. Dependence of the measurement offset upon equipment factors such as the incident angle of illumination was also studied. This paper also shows measurement offsets on critical levels of the sub-half micron device manufacturing.

Paper Details

Date Published: 1 July 1991
PDF: 11 pages
Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); doi: 10.1117/12.44441
Show Author Affiliations
Akira Kawai, Mitsubishi Electric Corp. (Japan)
Keiji Fujiwara, Mitsubishi Electric Corp. (Japan)
Kouichirou Tsujita, Mitsubishi Electric Corp. (Japan)
Hitoshi Nagata, Mitsubishi Electric Corp. (Japan)

Published in SPIE Proceedings Vol. 1464:
Integrated Circuit Metrology, Inspection, and Process Control V
William H. Arnold, Editor(s)

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