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Proceedings Paper

Parametric monitoring for the SUMMiT V surface-micromachining process
Author(s): Andrew D. Oliver; Danelle M. Tanner; Seethambal S. Mani; Scott E. Swanson; Karen S. Helgesen; Norman F. Smith
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Paper Abstract

This paper reports on a set of parametric monitors for Sandia National Laboratories SUMMiT V (TM) (Sandia Ultra-planar Multi-level MEMS `i' Technology) five-level polysilicon surface micromachining process. Parametric monitors are typically used to monitor changes in the process due to either process drifts or intentional process changes. These parametric monitors are one of three types: electrical, electromechanical, or stress. In this paper we report on the design and characterization of these devices as well as how these devices are used to quantify the characteristics of the SUMMiT VTM process. We will demonstrate the use of these parametric devices in defining a baseline process.

Paper Details

Date Published: 2 October 2001
PDF: 12 pages
Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.443008
Show Author Affiliations
Andrew D. Oliver, Sandia National Labs. (United States)
Danelle M. Tanner, Sandia National Labs. (United States)
Seethambal S. Mani, Sandia National Labs. (United States)
Scott E. Swanson, Sandia National Labs. (United States)
Karen S. Helgesen, Sandia National Labs. (United States)
Norman F. Smith, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 4558:
Reliability, Testing, and Characterization of MEMS/MOEMS
Rajeshuni Ramesham, Editor(s)

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