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Proceedings Paper

Optimization of anodic bonding to MEMS with self-assembled monolayer (SAM) coatings
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Paper Abstract

This work describes full wafer encapsulation of released, self-assembled monolayer (SAM) coated, multi-level polysilicon surface micromachines using the anodic bonding technique. This process has been utilized to protect fragile surface micromachines from damage due to particles, moisture contamination, and post-release die handling. The anodic bonding process was optimized to ensure strong glass-to-wafer bonds, while maintaining the effectiveness of liquid-phase and vapor-phase deposited SAM coatings. The temperature, time, and voltage effects on each SAM coating was analyzed. Glass-to-silicon and glass-to-SAM coated silicon had shear strengths of approximately 18 MPa. Glass-to-polysilicon bonds had lower shear strengths of approximately 10 MPa. Bonds were hermetic to 5 X 10-8 atm-cm3/s.

Paper Details

Date Published: 2 October 2001
PDF: 8 pages
Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.443007
Show Author Affiliations
Melissa V. Collins, Sandia National Labs. and New Mexico Institute of Mining and Technology (United States)
Lauren E. S. Rohwer, Sandia National Labs. (United States)
Andrew D. Oliver, Sandia National Labs. (United States)
Matthew G. Hankins, Sandia National Labs. (United States)
Deidre A. Hirschfeld, New Mexico Institute of Mining and Technology (United States)

Published in SPIE Proceedings Vol. 4558:
Reliability, Testing, and Characterization of MEMS/MOEMS
Rajeshuni Ramesham, Editor(s)

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