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Proceedings Paper

Nondestructive acoustic microimaging (AMI) analysis of MEMS materials, manufacturing, and packaging
Author(s): Steven R. Martell; Janet E. Semmens; Lawrence W. Kessler
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Paper Abstract

The main type of Acoustic Micro Imaging (AMI) system utilized in this study was the C-Mode Scanning Acoustic Microscope, which is a reflection mode instrument. In this paper we describe the method and application of AMI at frequencies beyond 200 MHz, which reveals defects in the 5 micron size range at depths of 500 microns within silicon.

Paper Details

Date Published: 2 October 2001
PDF: 8 pages
Proc. SPIE 4558, Reliability, Testing, and Characterization of MEMS/MOEMS, (2 October 2001); doi: 10.1117/12.443000
Show Author Affiliations
Steven R. Martell, Sonoscan, Inc. (United States)
Janet E. Semmens, Sonoscan, Inc. (United States)
Lawrence W. Kessler, Sonoscan, Inc. (United States)

Published in SPIE Proceedings Vol. 4558:
Reliability, Testing, and Characterization of MEMS/MOEMS
Rajeshuni Ramesham, Editor(s)

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