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Proceedings Paper

Toward the micromachined vibrating gyroscope using (111) silicon wafer process
Author(s): Jerwei Hsieh; Wen-Chih Chen; Weileun Fang
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Paper Abstract

The issues regarding structure design and fabrication in improving the performance of MVGs are discussed. Although using (111) Si wafer with existing HARM process is appropriate, some limitations on design and fabrication still exist. This study proposes a novel BELST process that can improve the device performance as well as fabrication capability of the existing techniques. The salient features of the process are described, and various design concepts have been demonstrated from the fabrication results. According to the result, MVGs with desired shape and thickness can easily be obtained using the developed BELST process.

Paper Details

Date Published: 28 September 2001
PDF: 9 pages
Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); doi: 10.1117/12.442961
Show Author Affiliations
Jerwei Hsieh, National Tsing Hua Univ. (Taiwan)
Wen-Chih Chen, National Tsing Hua Univ. (Taiwan)
Weileun Fang, National Tsing Hua Univ. (Taiwan)

Published in SPIE Proceedings Vol. 4557:
Micromachining and Microfabrication Process Technology VII
Jean Michel Karam; John A. Yasaitis, Editor(s)

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