
Proceedings Paper
Image processing techniques for the quantification of defects on aircraft materials obtained from infrared thermographsFormat | Member Price | Non-Member Price |
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Paper Abstract
In this research work, an experimental investigation was performed for the determination of defects on aircraft materials. Infrared thermographic active approach was used for the location and identification of defects on cracked aluminum panels untreated and repaired with carbon or boron epoxy composite patches. Furthermore, the quantification of these detected defects was attempted, using selected image processing and analysis techniques. Thermographic image analysis using histograms and digital image processing were applied on these obtained thermal images with the intention of calculating the localized defected areas. The results from these image analysis techniques were compared and discussed in terms of developing an integrated approach for the quantification of defects on aircraft components.
Paper Details
Date Published: 25 September 2001
PDF: 6 pages
Proc. SPIE 4548, Multispectral and Hyperspectral Image Acquisition and Processing, (25 September 2001); doi: 10.1117/12.441417
Published in SPIE Proceedings Vol. 4548:
Multispectral and Hyperspectral Image Acquisition and Processing
Qingxi Tong; Yaoting Zhu; Zhenfu Zhu, Editor(s)
PDF: 6 pages
Proc. SPIE 4548, Multispectral and Hyperspectral Image Acquisition and Processing, (25 September 2001); doi: 10.1117/12.441417
Show Author Affiliations
Antonia Moropoulou, National Technical Univ. of Athens (Greece)
Nicolas P. Avdelidis, National Technical Univ. of Athens (United Kingdom)
Nicolas P. Avdelidis, National Technical Univ. of Athens (United Kingdom)
Maria Karolglou, National Technical Univ. of Athens (Greece)
Zaira P. Marioli-Riga, Hellenic Aerospace Industry Ltd. (Greece)
Zaira P. Marioli-Riga, Hellenic Aerospace Industry Ltd. (Greece)
Published in SPIE Proceedings Vol. 4548:
Multispectral and Hyperspectral Image Acquisition and Processing
Qingxi Tong; Yaoting Zhu; Zhenfu Zhu, Editor(s)
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