Share Email Print

Proceedings Paper

Improvement of photomask repeater for 130-nm lithography
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Device masks for 180nm lithography was fabricated by PR system. These masks were verified by device yields comparing with masks written by other conventional systems. There were no differences in device yields between PR system and conventional system. Fine analysis of CD error was carried out for enhancement of CD uniformity to apply Photomask Repeater to 130nm lithography. It revealed that major CD error function is global CD error. By optimizing exposure dose of each shot to compensate global distribution, global CD error was reduced from 7.9nm to 5.5nm. Finally, CD uniformity of 8nm was achieved. PR system can afford to fulfill the requirement of CD uniformity for 130nm lithography. Simultaneously, the result of fine analysis indicates excellence of PR system in littleness of random error.

Paper Details

Date Published: 5 September 2001
PDF: 10 pages
Proc. SPIE 4409, Photomask and Next-Generation Lithography Mask Technology VIII, (5 September 2001); doi: 10.1117/12.438376
Show Author Affiliations
Suigen Kyoh, Toshiba Corp. (Japan)
Soichi Inoue, Toshiba Corp. (Japan)
Ichiro Mori, Toshiba Corp. (Japan)
Nobuyuki Irie, Nikon Corp. (Japan)
Yuuki Ishii, Nikon Corp. (Japan)
Toshikazu Umatate, Nikon Corp. (Japan)
Haruo Kokubo, Dai Nippon Printing Co., Ltd. (Japan)
Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 4409:
Photomask and Next-Generation Lithography Mask Technology VIII
Hiroichi Kawahira, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?