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Proceedings Paper

Improvement in E2 nozzle performance: no imprint and less contamination
Author(s): KianSiong Ang; Shu Jin Low; AikChin Lim; CheeKeong Lim; LiahKee Loh; Yew-Kong Tan; Xu Xiang Yang
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Paper Abstract

This paper demonstrates the use of lifted E2 nozzle with modified developer recipe in TEL MARK 8 track to reduce killer defects such as E2 nozzle imprints and contamination such as resist residues and developer strain. This concept has helped to improve machine uptime due to less occurrence of E2 nozzle related defects shutdown.

Paper Details

Date Published: 22 August 2001
PDF: 7 pages
Proc. SPIE 4344, Metrology, Inspection, and Process Control for Microlithography XV, (22 August 2001); doi: 10.1117/12.436753
Show Author Affiliations
KianSiong Ang, Chartered Semiconductor Manufacturing (Singapore)
Shu Jin Low, Chartered Semiconductor Manufacturing (Singapore)
AikChin Lim, Chartered Semiconductor Manufacturing Ltd. (Singapore)
CheeKeong Lim, Hermes-Epitek Corp. (Taiwan)
LiahKee Loh, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Yew-Kong Tan, Chartered Semiconductor Manufacturing Ltd. (Singapore)
Xu Xiang Yang, Changchun Institute of Optics and Fine Mechanics (China)

Published in SPIE Proceedings Vol. 4344:
Metrology, Inspection, and Process Control for Microlithography XV
Neal T. Sullivan, Editor(s)

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