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Proceedings Paper

Evaluation of Shipley XP2040D positive chemically amplified resist for SCALPEL mask fabrication
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Paper Abstract

The Semiconductor Industry Association (SIA) has placed stringent requirements on Next Generation Lithography mask critical dimension (CD) control. A new chemically amplified (CA) positive resist, Shipley XP2040D was evaluated for mask making application. This resist exhibited an extraordinary post exposure bake (PEB) sensitivity, less than 0.6 nm/ degree(s)C, along with a sub-50 nm resolution. The PEB stability in ambient was larger than 4.5 hours and the line-edge-roughness (LER) was less than 2.9 nm.

Paper Details

Date Published: 20 August 2001
PDF: 10 pages
Proc. SPIE 4343, Emerging Lithographic Technologies V, (20 August 2001); doi: 10.1117/12.436703
Show Author Affiliations
Bing Lu, Motorola (United States)
Zorian S. Masnyj, Motorola (United States)
Pawitter J. S. Mangat, Motorola (United States)
Kevin J. Nordquist, Motorola (United States)
Eric S. Ainley, Motorola (United States)
Douglas J. Resnick, Motorola (United States)

Published in SPIE Proceedings Vol. 4343:
Emerging Lithographic Technologies V
Elizabeth A. Dobisz, Editor(s)

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