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Proceedings Paper

Evaluation of new mask materials for improved lithography performance
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Paper Abstract

Mask materials are the often-overlooked link in the lithography chain. Chipmakers in general, have no idea of the optical properties of the mask substrate material that is being used to build his critical layer mask. By analyzing properties such as stress birefringence, transmission uniformity, index of refraction homogeneity, and certain laser damage properties it was found that a wide variation exists within the available population of mask substrate materials. Testing the impact of materials on a lithography tool demonstrated the wide range of performance that can be obtained from a population of mask substrates. For example, dose to clear tests gave results that ranged from 3.15mJ/cm2 to 3.25mJ/cm2 with dose non-uniformity ranging from 2.00% to 5.25%. This paper will discuss the tests that were made and the results to date. Due diligence on the selection of material substrates is required.

Paper Details

Date Published: 14 September 2001
PDF: 4 pages
Proc. SPIE 4346, Optical Microlithography XIV, (14 September 2001); doi: 10.1117/12.435782
Show Author Affiliations
Bryan S. Kasprowicz, Photronics, Inc. (United States)
Richard Priestley, Corning Inc. (United States)

Published in SPIE Proceedings Vol. 4346:
Optical Microlithography XIV
Christopher J. Progler, Editor(s)

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