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Proceedings Paper

Hybrid glass structures for telecommunication applications
Author(s): Robert D. Simpson; Joseph S. Hayden; Samuel D. Conzone; Berton Callicoatt; Alexana Roshko; Norman A. Sanford
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Paper Abstract

Hybrid glass parts composed of dissimilar glass sections are an attractive route to integrate multiple functions onto a single substrate and offer the potential to fabricate advanced laser sources, amplifiers, lossless splitters and other photonic devices such as Fabry-Perot etalons. We review the most promising bonding technologies, placing particular emphasis on techniques that do not require the use of high processing temperatures. In particular, we discuss in detail a recently developed low temperature bonding technology that relies on inorganic adhesives. Characterization of interfacial joints prepared with this inorganic technology indicate low insertion loss, high mechanical strength and chemical resistance to attack during the conventional lithographic and ion exchange steps employed to fabricate waveguide structures.

Paper Details

Date Published: 18 June 2002
PDF: 8 pages
Proc. SPIE 4640, Integrated Optics: Devices, Materials, and Technologies VI, (18 June 2002); doi: 10.1117/12.431629
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Published in SPIE Proceedings Vol. 4640:
Integrated Optics: Devices, Materials, and Technologies VI
Yakov S. Sidorin; Ari Tervonen, Editor(s)

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