Proceedings Paper
High-resolution noncontact thermal characterization of semiconductor devices| Format | Member Price | Non-Member Price |
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Paper Abstract
Non-contact optical methods can be used for sub micron surface thermal characterization of active semiconductor devices. Point measurements were first made, and then real time thermal images were acquired with a specialized PIN- array detector. This method of thermal imaging can have spatial resolution better than the diffraction limit of an infrared camera and can work in a wide range of ambient temperatures. The experimentally obtained thermal resolution is on the order of 50 mK.
Paper Details
Date Published: 5 June 2001
PDF: 7 pages
Proc. SPIE 4275, Metrology-based Control for Micro-Manufacturing, (5 June 2001); doi: 10.1117/12.429354
Published in SPIE Proceedings Vol. 4275:
Metrology-based Control for Micro-Manufacturing
Kenneth W. Tobin Jr.; Fred Lakhani, Editor(s)
PDF: 7 pages
Proc. SPIE 4275, Metrology-based Control for Micro-Manufacturing, (5 June 2001); doi: 10.1117/12.429354
Show Author Affiliations
James Christofferson, Univ. of California/Santa Cruz (United States)
Daryoosh Vashaee, Univ. of California/Santa Cruz (United States)
Daryoosh Vashaee, Univ. of California/Santa Cruz (United States)
Ali Shakouri, Univ. of California/Santa Cruz (United States)
Philip Melese, SRI International (United States)
Philip Melese, SRI International (United States)
Published in SPIE Proceedings Vol. 4275:
Metrology-based Control for Micro-Manufacturing
Kenneth W. Tobin Jr.; Fred Lakhani, Editor(s)
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