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Proceedings Paper

Positive-tone wafer coating materials evaluation on lithography process
Author(s): D. F. Huang; Jian-Yuan Chiou; Chih-Chien Hung; B. R. Young
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Paper Abstract

The polyimide technology has bene used extensively for semiconductor industry, includes buffer coating, interlayer dielectric and passivation, Alpha ray shielding and protective/insulating films. The features of the polyimide material for the new generation of advanced semiconductor products must have excellent properties and high performances to meet various demands in the microelectronics application. The requirements include high resolution, low internal stress, process cost reduction, environment safety, excellent process stability and window in the future. Three kinds of heat-resistant base polymers had been widely applied on wafer-coating processing microelectronic device including polyamic acids, ring-closure type soluble polyimides with hydroxyl groups, and PBO precursors. In this work, we had evaluated positive-tone photosensitivity with aqueous developed polyimide consisting of previous base resins, and compared the difference of process conditions, cured-film properties, adhesion properties, etching recipes as one mask process and reliability test, etc.

Paper Details

Date Published: 15 May 2001
PDF: 6 pages
Proc. SPIE 4277, Integrated Optics Devices V, (15 May 2001); doi: 10.1117/12.426818
Show Author Affiliations
D. F. Huang, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Jian-Yuan Chiou, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chih-Chien Hung, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
B. R. Young, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)

Published in SPIE Proceedings Vol. 4277:
Integrated Optics Devices V
Giancarlo C. Righini; Seppo Honkanen, Editor(s)

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