Share Email Print
cover

Proceedings Paper

Reliability of self-assembled 3D microstructures: snap-through modeling and experimental validation
Author(s): Olivier Millet; Lionel Buchaillot; Emmanuel Quevy; Dominique Collard
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This work considers the reliability of an elementary 3D structure, and particularly the response of a homogeneous, clamped-clamped polysilicon microfabricated beam, buckling under the compressive force produced by Scratch-Drive Actuators (SDA). First, using Galerkin's method, the governing partial differential equation reduced to a modified Duffing equation and was solved by the harmonic balance method. Besides the solution of simple harmonic motion (SHM) and superharmonic motion (SPHM) were found numerically using a Newton iteration method. Then, the study of continuity -- of these solutions -- allowed to analyze the stability boundaries. Finally, Runge-Kutta numerical integration method was used to investigate the snap-through problem. Intermittent, as well as continuous, snap-through behavior was obtained. The theoretical results agreed well with the experiments.

Paper Details

Date Published: 5 April 2001
PDF: 11 pages
Proc. SPIE 4408, Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, (5 April 2001); doi: 10.1117/12.425355
Show Author Affiliations
Olivier Millet, IEMN/CNRS (France)
Lionel Buchaillot, IEMN/CNRS (Japan)
Emmanuel Quevy, IEMN/CNRS (France)
Dominique Collard, IEMN/CNRS (France)


Published in SPIE Proceedings Vol. 4408:
Design, Test, Integration, and Packaging of MEMS/MOEMS 2001
Bernard Courtois; Jean Michel Karam; Steven Peter Levitan; Karen W. Markus; Andrew A. O. Tay; James A. Walker, Editor(s)

© SPIE. Terms of Use
Back to Top