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Proceedings Paper

Heterogeneous substrates for high-temperature and optical applications
Author(s): Manfred Reiche; V. Dragoi; M. Alexe; Ulrich M. Goesele; Erich Thallner; Ch. Schaefer; F. P. Lindner
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Paper Abstract

Further applications of MEMS require the combination of different materials in order to combine different functions in one and the same system. Besides conventional techniques (layer deposition methods) semiconductor wafer direct bonding is expected to be an effective method to produce heterogeneous materials. Different examples for optical and high-temperature applications are presented (Si-based heterostructures, Si/GaAs heterostructures).

Paper Details

Date Published: 30 April 2001
PDF: 9 pages
Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425327
Show Author Affiliations
Manfred Reiche, Max-Planck-Institut fuer Mikrostrukturphysik (Germany)
V. Dragoi, Max-Planck-Institut fuer Mikrostrukturphysik (Germany)
M. Alexe, Max-Planck-Institut fuer Mikrostrukturphysik (Germany)
Ulrich M. Goesele, Max-Planck-Institut fuer Mikrostrukturphysik (Germany)
Erich Thallner, Electronic Visions Group (Austria)
Ch. Schaefer, Electronic Visions Group (Austria)
F. P. Lindner, Electronic Visions Group (Austria)

Published in SPIE Proceedings Vol. 4407:
MEMS Design, Fabrication, Characterization, and Packaging
Uwe F. W. Behringer; Deepak G. Uttamchandani, Editor(s)

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