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Proceedings Paper

High-volume production cost savings methods in MEMS fabrication
Author(s): Joe Brown
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Paper Abstract

Aligned substrate bonding has developed into high volume production solutions that meet the ever-increasing needs for fabrication and performance criteria. This presentation will update the audience on recent developments for high volume production of MEMS/MST.

Paper Details

Date Published: 30 April 2001
PDF: 4 pages
Proc. SPIE 4407, MEMS Design, Fabrication, Characterization, and Packaging, (30 April 2001); doi: 10.1117/12.425322
Show Author Affiliations
Joe Brown, Karl Suess GmbH & Co. (United States)


Published in SPIE Proceedings Vol. 4407:
MEMS Design, Fabrication, Characterization, and Packaging
Uwe F. W. Behringer; Deepak G. Uttamchandani, Editor(s)

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