Share Email Print

Proceedings Paper

Simulation of novel microassembly using shape memory alloy
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

In this paper, a novel micro assembly method using Shape Memory Alloy (SMA) is investigated. The principle of this method and its advantages are briefly discussed. A finite element package, ANSYS, is used to simulate the whole assembly process. A special material element is used for modeling the behavior of SMA.

Paper Details

Date Published: 21 March 2001
PDF: 9 pages
Proc. SPIE 4235, Smart Structures and Devices, (21 March 2001); doi: 10.1117/12.420848
Show Author Affiliations
Weiming Huang, Nanyang Technological Univ. (Singapore)
Xiangyang Gao, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 4235:
Smart Structures and Devices
Dinesh K. Sood; Ronald Albert Lawes; Vasundara V. Varadan, Editor(s)

© SPIE. Terms of Use
Back to Top