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Proceedings Paper

Photosensitive ormosil system for integrated optics
Author(s): Graham R. Atkins; Robert B. Charters; Barry Luther-Davies
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Paper Abstract

A photosensitive organically modified silica (ormosil) material has been developed for integrated optics applications. In this material, prepared via a simple one- step sol-gel process, the silica backbone is substituted with methacrylate groups to confer photosensitivity, and with phenyl and/or methyl groups to adjust the refractive index from 1.47 to 1.52. Ormosil films are spin-coated onto silica-on-silicon substrates, and waveguides are defined in the films using a 325 nm HeCd laser direct write system. The unexposed regions are then dissolved with isopropanol to leave the desired pattern of ridge waveguides, before baking. The width of the waveguides increases with the UV dose and the concentrations of the methacrylate groups and the photo-initiator. Waveguides with widths >= 5 micrometers have been written with UV doses of around 0.4 J/cm2, and baked at up to 200 degree(s)C without cracking. In the 1310 and 1550 nm communications windows, the major sources of optical loss are vibration overtones of OH and CH groups. The intensities of these absorption bands have been measured with infrared spectroscopy and photothermal deflection spectroscopy, and the effects of some strategies to reduce the concentration of CH and/or OH groups, including fluorination and higher baking temperatures, are assessed.

Paper Details

Date Published: 2 February 2001
PDF: 10 pages
Proc. SPIE 4216, Optical Devices for Fiber Communication II, (2 February 2001); doi: 10.1117/12.414110
Show Author Affiliations
Graham R. Atkins, Univ. of Sydney (Australia)
Robert B. Charters, Australian National Univ. and Redfern Polymer Optics (Australia)
Barry Luther-Davies, Australian National Univ. (Australia)

Published in SPIE Proceedings Vol. 4216:
Optical Devices for Fiber Communication II
Dilip K. Paul; Michel J. F. Digonnet; Osman S. Gebizlioglu; Osman S. Gebizlioglu; Roger A. Greenwell; Roger A. Greenwell; Dennis N. Horwitz; Dennis N. Horwitz; Dilip K. Paul, Editor(s)

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