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Proceedings Paper

Plasma etch of binary Cr masks: CD uniformity study of photomasks utilizing varying Cr loads: III
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Paper Abstract

The use of Plasma Etch for the fabrication of Binary Cr Photomasks has become a mainstream staple for advanced Reticle fabrication. These Binary Cr Reticles are suitable for the 0.18 micron technology Nodes and beyond and have forced an appreciation of the varying exposed Cr loads of different Mask layers.

Paper Details

Date Published: 22 January 2001
PDF: 12 pages
Proc. SPIE 4186, 20th Annual BACUS Symposium on Photomask Technology, (22 January 2001); doi: 10.1117/12.410745
Show Author Affiliations
Chris Constantine, Unaxis USA, Inc. (United States)
Russell J. Westerman, Unaxis USA, Inc. (United States)
Jason Plumhoff, Unaxis USA, Inc. (United States)

Published in SPIE Proceedings Vol. 4186:
20th Annual BACUS Symposium on Photomask Technology
Brian J. Grenon; Giang T. Dao, Editor(s)

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