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Proceedings Paper

Design and reliability aspects of multilevel metal large-scale power line layouts in ULSI-ICs
Author(s): Peter J. Jacob; Giovanni Nicoletti
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Paper Abstract

Integration of both extremely small-dimensioned metal lines and large-dimensioned metal structures may cause reliability problems due to thermomechanical stress between the intermetal dielectric and the multi-level-metalization. The paper reports a case study and shows a problem solution approach: due to thermomechanical mismatch of aluminum and Si-oxide, metalization processing should not be used for both small and large structures. This may cause cracks and generate intermetallic shorts as a reliability problem.

Paper Details

Date Published: 23 August 2000
PDF: 7 pages
Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); doi: 10.1117/12.410074
Show Author Affiliations
Peter J. Jacob, EM Microelectronic-Marin SA (Switzerland) and Swiss Federal Institute for Materials Testin (Switzerland)
Giovanni Nicoletti, Swiss Federal Institute for Materials Testing and Research (Switzerland)


Published in SPIE Proceedings Vol. 4182:
Process Control and Diagnostics
Michael L. Miller; Kaihan A. Ashtiani, Editor(s)

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