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Proceedings Paper

Advanced visible/infrared microcameras for dual-use applications
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Paper Abstract

Irvine Sensors Corporation (ISC) has pioneered the use of a chip stacking technology that allows an entire electronics system to be packaged into a single 3-dimensional cube of electronics. This stacking approach allows the elimination of traditional printed circuit boards (PCB) and as a result significantly reduces the size of the electronics. Recently this technology has been applied to electronic camera applications including both high-resolution digital still picture and video camera technologies. In addition this electronics implementation approach is under evaluation for application in the SWIR and LWIR/thermal imaging spectral bands.

Paper Details

Date Published: 15 December 2000
PDF: 8 pages
Proc. SPIE 4130, Infrared Technology and Applications XXVI, (15 December 2000); doi: 10.1117/12.409905
Show Author Affiliations
William B. Hornback, Irvine Sensors Corp. (United States)
Charles S. Kaufman, Irvine Sensors Corp. (United States)

Published in SPIE Proceedings Vol. 4130:
Infrared Technology and Applications XXVI
Bjorn F. Andresen; Gabor F. Fulop; Marija Strojnik, Editor(s)

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