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Proceedings Paper

Hole drilling of glass substrates with a slab waveguide CO2 laser
Author(s): Yoshikazu Yoshida; Yuji Kobayashi; Tiejun Zhang; Hiroyoshi Yajima; Yuji Hashidate; Hiroshi Ogura
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Paper Abstract

Using 30-1000 (mu) s pulses and 9.3 (mu) m wavelength from a CO2 slab waveguide laser, focused to a spot size of 130 (mu) m, we have produced holes in synthetic quartz, soda-lime glass, and Pyrex glass substrates. In the three types of substrates, the mass removal per pulse increases almost linearly with the pulse energy used to vary the pulse interval. The removal rates of the three substrates are almost the same. We examine the effect of the pulse interval on the hole structure and the pile-up around the hole in single- and multiple-pulse hole drilling. The deformation on the pile-up region can be accounted by the melting walls of the hole. Moreover, we examine the effect of pulse energy on the inclination of the hole walls. A multiple-pulse hole shaping technique is effective in decreasing the height coefficient of the pile-up region and the angle of inclination.

Paper Details

Date Published: 6 November 2000
PDF: 4 pages
Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); doi: 10.1117/12.405747
Show Author Affiliations
Yoshikazu Yoshida, Toyo Univ. (Japan)
Yuji Kobayashi, Yamanashi Univ. (Japan)
Tiejun Zhang, Yamanashi Univ. (Japan)
Hiroyoshi Yajima, Matsushita Research Institute of Tokyo Inc. (Japan)
Yuji Hashidate, Matsushita Research Institute of Tokyo Inc. (Japan)
Hiroshi Ogura, Matsushita Research Institute of Tokyo Inc. (Japan)

Published in SPIE Proceedings Vol. 4088:
First International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Koji Sugioka; Thomas W. Sigmon, Editor(s)

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