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Proceedings Paper

Laser joining of microcomponents with fiber lasers and diode lasers
Author(s): Arnold Gillner; Luedger Bosse; Thorsten Kramer; Alexander M. Olowinsky; M. Wild
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Paper Abstract

The production of microsystems and miniaturized devices often requires joining technologies, which meet the demands of ultra clean manufacturing. Especially for optical and medical products low pollution and distortion joining processes are necessary to guarantee the quality and the function of the device. For this applications laser welding with fiber lasers at laser powers of up to P = 10 W and focus dimensions < 30 micrometers have been used for welding micro mechanical devices. At intensities I > 106W/cm2 welding depths of 100 micrometers can be achieved with minimized pollution of the parts and smooth and clean appearance of the surface of the welds. For joining polymers and dissimilar materials high power diode lasers have been used providing even better conditions regarding pollution of the joining partners. By using material adapted laser wavelengths the heating of the material can be concentrated to the inner joining area of an overlap material joint. With this technique, thermoplastic polymer compounds and silicon glass compounds have been joined with low temperature and no influence on the quality of the parts with joining widths of less that 100 micrometers .

Paper Details

Date Published: 6 November 2000
PDF: 4 pages
Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); doi: 10.1117/12.405715
Show Author Affiliations
Arnold Gillner, Fraunhofer Institute for Laser Technology (Germany)
Luedger Bosse, Fraunhofer Institute for Laser Technology (Germany)
Thorsten Kramer, Fraunhofer Institute for Laser Technology (Germany)
Alexander M. Olowinsky, Fraunhofer Institute for Laser Technology (Germany)
M. Wild, Fraunhofer Institute for Laser Technology (Germany)

Published in SPIE Proceedings Vol. 4088:
First International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Koji Sugioka; Thomas W. Sigmon, Editor(s)

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