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Proceedings Paper

Numerical simulation of microassembly of MEMS devices and post-assembly electromechanical actuation
Author(s): Daniel J. Keating; Yie He; Nora Finch; James Marchetti
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Paper Abstract

This paper presents the latest result on ongoing numerical simulation research of assembly and post-assembly analysis of MEMS devices. Evolving MEMS technologies, including the use of micro-fabricated hinges and gears, have enabled the fabrication of micro-assembled MEMS devices. Examples of these devices include tilting micromirrors, latching mechanisms, and micromotors. A simulation methodology has been developed that allows a MEMS designer to not only model the assembly process, but also to model the effects of various stimuli on the assembled device. Using these capabilities, a MEMS designer can investigate the necessary actuation forces, interfacing mechanisms, and time constraints for micro-assembly, as well as the performance of the device in its assembled state. These simulations rely on multi-stage non-rigid multi-entity contact analysis, dynamic analysis, and large displacement theory. Results are presented for a developed micromirror examples. The assembly process for the 'pop-up' micromirror mechanism are analyzed. After assembly, the coupled electromechanical actuation behavior will be studied. Changes in structural stress, stiffness, natural frequency, and mirror flatness are calculated and show a marked difference from the unstressed/undeformed shape. The newly developed algorithms allow designers to simulate and look into the details of phenomena often ignored in conventional MEMS design. Recent improvements in simulation methodologies allow micro- assembly analyses and post-assembly analyses of the resulting devices. By enabling micro-assembly and post- assembly analyses, we present the first reported MEMS analysis tool capable of modeling the latching mechanisms and post-latching actuation that frequently control current MEMS devices.

Paper Details

Date Published: 24 October 2000
PDF: 8 pages
Proc. SPIE 4228, Design, Modeling, and Simulation in Microelectronics, (24 October 2000); doi: 10.1117/12.405440
Show Author Affiliations
Daniel J. Keating, IntelliSense Corp. (United States)
Yie He, IntelliSense Corp. (United States)
Nora Finch, IntelliSense Corp. (United States)
James Marchetti, IntelliSense Corp. (United States)


Published in SPIE Proceedings Vol. 4228:
Design, Modeling, and Simulation in Microelectronics
Bernard Courtois; Serge N. Demidenko; Lee Y. Lau, Editor(s)

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