Microfabrication technologies for use as practical methods in > 10-micrometers featured high-speed device fabrication have been developed: the thick polyimide-used damascene process, electroless plating of Ru/Ni on Cu interconnections, the area-restricted chemical mechanical planarization to polish thick polyimide films. Applying their technologies to fabricate RF-components and millimeter-wave components on Si demonstrates excellent characteristics: high-quality factor (Q-factor) in spiral inductor, low transmission loss for sidewall coplanar waveguide (CPW), high-power radiation in CPW-fed sot antenna. The Si-technology-based approach to achieve seamless integration of different kinds of devices, i.e., photonic devices, ULSIs, RF-devices, and millimeter- wave devices are promising ways to fabricate high-speed systems on Si.

Date Published: 20 October 2000
PDF: 10 pages
Proc. SPIE 4230, Micromachining and Microfabrication, (20 October 2000); doi: 10.1117/12.404913

Published in SPIE Proceedings Vol. 4230:
Micromachining and Microfabrication
Kevin H. Chau; M. Parameswaran; Francis E.H. Tay, Editor(s)