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Proceedings Paper

MEMS variable capacitor for one-chip rf front end
Author(s): Seonho Seok; Chul Nam; KukJin Chun
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Paper Abstract

Area-varying tunable MEMS (MicroElectroMechanical Systems) capacitor with 608 comb fingers is developed. The 6 um-thick single crystal silicon MEMS structure is bonded to the pyrex glass substrate using the glass-silicon anodic bonding technique and chemical mechanical polish to make the designed capacitor. The pyrex glass is used as a substrate instead of the silicon for reducing the RF losses through the substrate. The measured capacitor shows the nominal capacitance of 1.4 pF, Q-factor of 4 at 1 GHz. The capacitor model is also developed and proved by Serenade software of Ansoft Corporation.

Paper Details

Date Published: 20 October 2000
PDF: 8 pages
Proc. SPIE 4230, Micromachining and Microfabrication, (20 October 2000);
Show Author Affiliations
Seonho Seok, Seoul National Univ. (South Korea)
Chul Nam, Seoul National Univ. (South Korea)
KukJin Chun, Seoul National Univ. (South Korea)

Published in SPIE Proceedings Vol. 4230:
Micromachining and Microfabrication
Kevin H. Chau; M. Parameswaran; Francis E.H. Tay, Editor(s)

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