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Proceedings Paper

Thermal characterization of tape BGA package by modeling
Author(s): Jiang-Bo Han
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Paper Abstract

In microelectronic industry, numerical modeling is an effective way to predict thermal performance of IC packages in the initial development stage. Moreover, thermal simulation can provide a greater understanding of the physics of the problem, allowing design to be optimized quickly and cheaply, thereby shortening packaging development cycle time and keeping expensive experimental measurements to a minimum. In this study, 3D finite element analysis (FEA) thermal models capturing the details of the solder ball and internal structure of the tap BGA package are developed. Accuracy of the developed FEA models is validated by bench marking with the measurement for 35mm by 35mm 352 TBGA package. Numerical results of the thermal performance of the TBGA package under various die size and heat-spreader remaining thickness are presented. The thermal metrics, Theta-JA, Psi-JT, and Psi-JB, of the package are characterized numerically. Relationships between these three thermal metrics are established. These relationships are useful to correlate one thermal parameter of the package to another.

Paper Details

Date Published: 23 October 2000
PDF: 7 pages
Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404880
Show Author Affiliations
Jiang-Bo Han, Agilent Technologies Singapore Pte Ltd. (Singapore)

Published in SPIE Proceedings Vol. 4229:
Microelectronic Yield, Reliability, and Advanced Packaging
Cher Ming Tan; Yeng-Kaung Peng; Mali Mahalingam; Krishnamachar Prasad, Editor(s)

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