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Proceedings Paper

Projecting wafer probe yields for products fabricated in new technologies
Author(s): Ron Ross; Nick Atchison
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Paper Abstract

It is desirable to be able to forecast wafer probe yields for new products to be fabricated using the next generation technology. This is advantageous to assess the cost effectiveness of developing new technologies as well as to be able to plan wafer starts for these products.

Paper Details

Date Published: 23 October 2000
PDF: 10 pages
Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404861
Show Author Affiliations
Ron Ross, Texas Instruments, Inc. (United States)
Nick Atchison, PDF Solutions, Inc. (United Kingdom)

Published in SPIE Proceedings Vol. 4229:
Microelectronic Yield, Reliability, and Advanced Packaging
Cher Ming Tan; Yeng-Kaung Peng; Mali Mahalingam; Krishnamachar Prasad, Editor(s)

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