Share Email Print
See all the new books from SPIE
cover

Proceedings Paper

VCSEL-based optoelectronic multiple-chip modules
Author(s): Hongda Chen; Kun Liang; Yun Du; Yongzhen Huang; Jun Tiang; Xiaoyu Ma; Rong Han Wu; Shuyong Li; Weilian Guo; Guangjun Xu; Yong Wang
Format Member Price Non-Member Price
PDF $17.00 $21.00
Add to cart
Paper Abstract
We report on optoelectronic multiple chip modules, consisting of vertical cavity surface emitting laser (VCSEL), photodetector and 1.2 micrometer CMOS electronic circuit. The hybrid integrated components operate at a date rate of 155 Mb/s, which could be used in optical interconnects for multiple computers.
Paper Details
Date Published: 9 October 2000
PDF: 4 pages
Proc. SPIE 4225, Optical Interconnects for Telecommunication and Data Communications, (9 October 2000); doi: 10.1117/12.402681
Show Author Affiliations
Hongda Chen, Institute of Semiconductors (China)
Kun Liang, Institute of Semiconductors (China)
Yun Du, Institute of Semiconductors (China)
Yongzhen Huang, Institute of Semiconductors (China)
Jun Tiang, Institute of Semiconductors (China)
Xiaoyu Ma, Institute of Semiconductors (China)
Rong Han Wu, Institute of Semiconductors (China)
Shuyong Li, Tianjin Univ. (China)
Weilian Guo, Tianjin Univ. (China)
Guangjun Xu, Shenzhen Photon Technology Co., Ltd. (China)
Yong Wang, Shenzhen Photon Technology Co., Ltd. (China)

Published in SPIE Proceedings Vol. 4225:
Optical Interconnects for Telecommunication and Data Communications
Xiaomin Ren; Suning Tang, Editor(s)
© SPIE. Terms of Use
Back to Top