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Proceedings Paper

Optical interconnects in high-density data communications
Author(s): Zhiping James Zhou
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Paper Abstract

Development in both systems and applications are driving semiconductor technology towards gigascale and terascale integration. The electrical interconnection networks are severely limiting this effort due to RC delay, clock skew, crosstalk, and electromigration. Many novel communication mechanisms have been proposed, but the optical interconnection remains as the most promising candidate. This paper is to review the optical interconnection in high-density data communications, from the point of view of semiconductor technology, and present the most recent developments and results.

Paper Details

Date Published: 9 October 2000
PDF: 6 pages
Proc. SPIE 4225, Optical Interconnects for Telecommunication and Data Communications, (9 October 2000); doi: 10.1117/12.402680
Show Author Affiliations
Zhiping James Zhou, Georgia Institute of Technology (United States)

Published in SPIE Proceedings Vol. 4225:
Optical Interconnects for Telecommunication and Data Communications
Xiaomin Ren; Suning Tang, Editor(s)

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